Most recent
SAE AMS 3692C-1995 (SAE AMS3692C-1995)
Adhesive Compound, Epoxy Resin, High Temperature Application ( Reaffirmed: May 2005 )
This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste. This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.
CONTENT PROVIDER
Society of Automotive Engineers [sae]
Society of Automotive Engineers [sae]