Historical
IPC 2222A-2010
Sectional Design Standard for Rigid Organic Printed Boards
IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to singlesided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/ interconnections. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes.
Content Provider
Association Connecting Electronics Industries [ipc]
