Most recent

IPC 7711/7721C-HU-2017

Rework, Modification and Repair of Electronic Assemblies (Hungarian Version)


This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.


CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Document History
Included in Packages
This standard is not included in any packages.
Amendments & Corrections
We have no amendments or corrections for this standard.