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Other Electronic Components Standards

US and international standards for electronic components, capacitors, transducers, surge protectors, LEDs, and resistors find wide application in consumer products, vehicles, medical devices, sensors and controls for industrial use and more. A representative selection of nearly one hundred standards published in recent years covering electronic components are provided here. For even more electronic component standards search by keyword in the field above or browse the offerings of the International Electrotechnical Commission (IEC) and the Institute of Electrical and Electronics Engineers (IEEE), two standard developing organizations focused on electronics and their design, manufacture, testing, use, and end-of-life procedures.

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IEC 61188-7 Ed. 2.0 en:2017

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

IEC 61188-7:2017(E) establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners. This edition includes the following significant technical changes with respect to the previous edition: a) Figure 1 has been corrected; b) the term rectangle has generally been replaced by polygon ; c) level B has been indicated as preferred level for new libraries.


IEC/TS 62686-1 Ed. 3.0 en:2020

Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

IEC TS 62686-1:2020 is available as IEC TS 62686-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC TS 62686-1:2020 defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition: - update related to obsolescence of STACK Specification S/0001 revision 14 notice 3; - addition of alternative automotive methods of compliance and revision of Annex B initially related to cross-reference to STACK Specification S/0001; - addition of an Annex C to include a requirement matrix for IEC TS 62686-1 verification.


IEC/TS 62564-1 Ed. 3.0 en:2016

Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors

IEC TS 62564-1:2016(E) defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)". This new edition includes the following significant technical changes with respect to the previous edition: - refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications; - adds information regarding components' life expectancy.


IEC 60286-1 Ed. 3.0 en:2017

Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes

IEC 60286-1:2017(E) applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for the preforming of leads, automatic handling, insertion and other operations, and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: a) a complete revision of the structure (detailed in Annex A) and reworked layout.


IEC 60286-2 Ed. 4.0 b:2015

Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes

IEC 60286-2:2015 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, pre-forming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes. This edition includes the following significant changes with respect to the previous edition: - A complete revision of the structure and reworked layout. - A two page overview containing a clear overview of all symbols and references. - Addition of annexes of known radial tape formats. - Improved figures.


IEC 60286-3 Ed. 6.0 b:2019

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value with regard to tilt.


IEC 60286-4 Ed. 3.0 b:2013

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.


IEC 60286-5 Ed. 2.1 b:2009

Packaging of components for automatic handling - Part 5: Matrixtrays

IEC 60286-5:2003+A1:2009 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. This consolidated version consists of the second edition (2003) and its amendment 1 (2009). Therefore, no need to order amendment in addition to this publication.


IEC 60286-6 Ed. 2.0 b:2004

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components

is applicable to bulk case packaging capable of containing surface mounting components. The bulk case is designed for transport and storage of components and the supply of components directly or by an appropriate feeder to the placement machine. The bulk case is attached to the automatic handling machine by means of a coupling interface



IEC 60068-2-69 Ed. 3.0 b:2017

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.


IEC 60068-2-83 Ed. 1.0 b:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

"IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method. "


SAE ARP 6178-2011 (SAE ARP6178-2011)

Fraudulent/Counterfeit Electronic Parts; Tool for Risk Assessment of Distributors

This SAE Aerospace Recommended Practice is applicable for all organizations that procure electronic components from sources other than the original component manufacturer of the component. It is especially applicable for assessing distributors that sell electronic components without contractual authorization from the original component manufacturer


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