Lead Bonding

Semiconductor Fabrication Standards cover the production process of semiconductors. Given the importance of clean rooms, these standards address gas distribution in that context, as well as the use and quality of water. Additionally, IEC 62258 provides information about semiconductor die products. Other topics of importance are included as well, such as EM immunity, examination of semiconductors, and aerospace-specific requirements.

1.1 This specification covers aluminum 1 % silicon alloy wire for internal connections in semiconductor devices and is limited to wire of diameter up to and including 76 m (0.003 in.). For diameters larger than 76 m (0.003 in.), the specifications are to be agreed upon between the purchaser and the supplier. 1.2 The values stated in SI units are to be regarded as the standard, regardless of whether they appear first or second in a table. Values given in parentheses are for information only. 1.3 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

Available for Subscriptions

PDF Price

$66.00

0 Add to cart

Lead Bonding

ASTM F487-13(2018)

Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding