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Examination

Semiconductor Fabrication Standards cover the production process of semiconductors. Given the importance of clean rooms, these standards address gas distribution in that context, as well as the use and quality of water. Additionally, IEC 62258 provides information about semiconductor die products. Other topics of importance are included as well, such as EM immunity, examination of semiconductors, and aerospace-specific requirements.


ASTM E1161-21

Standard Practice for Radiographic Examination of Semiconductors and Electronic Components

1.1 This practice provides the minimum requirements for nondestructive radiographic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these items. 1.2 This practice covers the radiographic examination of these items to detect possible defective conditions within the sealed case, especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects), improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used), solder defects, or physical damage. 1.3 Basis of Application - There are areas in this practice that may require agreement between the cognizant engineering organization and the supplier, or specific direction from the cognizant engineering organization. These items should be addressed in the purchase order, contract, or inspection technique. Specific applications may require adherence to this practice in part or in full. Deviations from this practice shall be enumerated in inspection plan and approved by both cognizant engineering organization and supplier. 1.4 Units - The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this practice. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


ASTM E2387-19

Standard Practice for Goniometric Optical Scatter Measurements

1.1 This practice describes procedures for determining the amount and angular distribution of optical scatter from a surface. In particular it focuses on measurement of the bidirectional scattering distribution function (BSDF). BSDF is a convenient and well accepted means of expressing optical scatter levels for many purposes. It is often referred to as the bidirectional reflectance distribution function (BRDF) when considering reflective scatter or the bidirectional transmittance distribution function (BTDF) when considering transmissive scatter. 1.2 The BSDF is a fundamental description of the appearance of a sample, and many other appearance attributes (such as gloss, haze, and color) can be represented in terms of integrals of the BSDF over specific geometric and spectral conditions. 1.3 This practice also presents alternative ways of presenting angle-resolved optical scatter results, including directional reflectance factor, directional transmittance factor, and differential scattering function. 1.4 This practice applies to BSDF measurements on opaque, translucent, or transparent samples. 1.5 The wavelengths for which this practice applies include the ultraviolet, visible, and infrared regions. Difficulty in obtaining appropriate sources, detectors, and low scatter optics complicates its practical application at wavelengths less than about 0.2 m (200 nm). Diffraction effects start to become important for wavelengths greater than 15 m (15 000 nm), which complicate its practical application at longer wavelengths. Measurements pertaining to visual appearance are restricted to the visible wavelength region. 1.6 This practice does not apply to materials exhibiting significant fluorescence. 1.7 This practice applies to flat or curved samples of arbitrary shape. However, only a flat sample is addressed in the discussion and examples. It is the user s responsibility to define an appropriate sample coordinate system to specify the measurement location on the sample surface and appropriate beam properties for samples that are not flat. 1.8 This practice does not provide a method for ascribing the measured BSDF to any scattering mechanism or source. 1.9 This practice does not provide a method to extrapolate data from one wavelength, scattering geometry, sample location, or polarization to any other wavelength, scattering geometry, sample location, or polarization. The user must make measurements at the wavelengths, scattering geometries, sample locations, and polarizations that are of interest to his or her application. 1.10 Any parameter can be varied in a measurement sequence. Parameters that remain constant during a measurement sequence are reported as either header information in the tabulated data set or in an associated document. 1.11 The apparatus and measurement procedure are generic, so that specific instruments are neither excluded nor implied in the use of this practice. 1.12 For measurements performed for the semiconductor industry, the operator should consult Guide SEMI ME 1392. 1.13 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.14 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


ASTM E2698-18e1

Standard Practice for Radiographic Examination Using Digital Detector Arrays

1.1 This practice establishes the minimum requirements for radiographic examination of metallic and nonmetallic materials using digital detector arrays (DDAs). 1.2 The stated requirements of this specification are based on the use of an X-ray generating source. Additionally, some of the tests and requirements may not be applicable to X-ray energy levels 450kV. 1.3 The requirements in this practice are intended to control the quality of radiographic examinations obtained using DDAs and are not intended to establish acceptance criteria for parts or materials. 1.4 This practice covers the radiographic examination with DDAs including DDAs described in Practice E2597/E2597M such as a device that contains a photoconductor attached to a Thin Film Transistor (TFT) read out structure, a device that has a phosphor coupled directly to an amorphous silicon read-out structure, and devices where a phosphor is coupled to a CMOS (complementary metal oxide semiconductor) array, or a CCD (charge coupled device) crystalline silicon read-out structure. 1.5 The requirements of this practice and Practice E2737 shall be used together. The requirements of Practice E2737 will provide the baseline evaluation and long term stability test procedures for the DDA system. The user of the DDA system shall establish a written procedure that addresses the specific requirements and tests to be used in their application and shall be approved by the Cognizant Radiographic Level 3 before examination of production hardware. This practice also requires the user to perform a system qualification suitable for its intended purpose and to issue a system qualification report (see 9.1 ). 1.6 The DDA shall be selected for an NDT application based on knowledge of the technology described in Guide E2736 , and of the selected DDA properties provided by the manufacturer in accordance with Practice E2597/E2597M . 1.7 Techniques and applications employed with DDAs are diverse. This practice is not intended to be limiting or restrictive. Refer to Guides E94/E94M , E1000 , and E2736 , Terminology E1316 , Practices E747 and E1025 , and Federal Standards 21-CFR-1020.40 and 29-CFR-1910.96 for a list of documents that provide additional information and guidance. 1.8 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.


ISO 29301:2017

Microbeam analysis - Analytical electron microscopy - Methods for calibrating image magnification by using reference materials with periodic structures

ISO 29301:2017 specifies a calibration procedure applicable to images recorded over a wide magnification range in a transmission electron microscope (TEM). The reference materials used for calibration possess a periodic structure, such as a diffraction grating replica, a super-lattice structure of semiconductor or an analysing crystal for X-ray analysis, and a crystal lattice image of carbon, gold or silicon. This document is applicable to the magnification of the TEM image recorded on a photographic film, or an imaging plate, or detected by an image sensor built into a digital camera. This document also refers to the calibration of a scale bar. This document does not apply to the dedicated critical dimension measurement TEM (CD-TEM) and the scanning transmission electron microscope (STEM).


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