Water

Semiconductor Fabrication Standards cover the production process of semiconductors. Given the importance of clean rooms, these standards address gas distribution in that context, as well as the use and quality of water. Additionally, IEC 62258 provides information about semiconductor die products. Other topics of importance are included as well, such as EM immunity, examination of semiconductors, and aerospace-specific requirements.

1.1 This guide provides recommendations for water quality related to electronics and semiconductor-industry manufacturing. Seven classifications of water are described, including water for line widths as low as 0.032 m. In all cases, the recommendations are for water at the point of distribution (POD). 1.2 Water is used for washing and rinsing of semiconductor components during manufacture. Water is also used for cleaning and etching operations, making steam for oxidation of silicon surfaces, preparing photomasks, and depositing luminescent materials. Other applications are in the development and fabrication of solid-state devices, thin-film devices, communication lasers, light-emitting diodes, photo-detectors, printed circuits, memory devices, vacuum-tube devices, or electrolytic devices. 1.3 Users needing water qualities different from those described here should consult other water standards, such as Specification D1193 and Guide D5196 . 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

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ASTM D5544-16

Standard Test Method for On-Line Measurement of Residue After Evaporation of High-Purity Water

1.1 This test method covers the determination of dissolved organic and inorganic matter and colloidal material found in high-purity water used in the semiconductor, and related industries. This material is referred to as residue after evaporation (RAE). The range of the test method is from 0.001 g/L (ppb) to 60 g/L (ppb). 1.2 This test method uses a continuous, real time monitoring technique to measure the concentration of RAE. A pressurized sample of high-purity water is supplied to the test method's apparatus continuously through ultra-clean fittings and tubing. Contaminants from the atmosphere are therefore prevented from entering the sample. General information on the test method and a literature review on the continuous measurement of RAE has been published. 2 1.3 The values stated in SI units are to be regarded as standard. The values given in parentheses are mathematical conversions to inch-pound units that are provided for information only and are not considered standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazards statements, see Section 8 .

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Water

ASTM D5127-13(2018)

Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries

ASTM D5544-16

Standard Test Method for On-Line Measurement of Residue After Evaporation of High-Purity Water