IPC: Association Connecting Electronics Industries
IPC, the Association Connecting Electronics Industries, is a nonprofit organization that develops and publishes standards guiding the assembly and production of electronic equipment. Headquartered near Chicago, United States, IPC standards are the most widely used acceptability standards in the electronics industry. IPC standards are used by over 3,600 certified trainers and testers. In addition to individual members, IPC has offices and representatives throughout the world to gather more input for its standards and to further spread them.
Below are IPC's best-selling standards. To find additional standards, please use the search bar above.
IPC/WHMA A-620D-2020
Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies. IPC/WHMA-A-620D was developed by IPC and the Wire Harness Manufacturers Association (WHMA) (An affiliate of IPC).
IPC A-610H-2020
IPC-A-610H: Acceptability of Electronic Assemblies
IPC-A-610H is the most widely used electronics assembly acceptance standard in the electronics industry. IPC-A-610H standard includes a general update to the document, introduces several new surface mount component types and removes target conditions. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry. This is a must-have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. IPC-A-610 is developed in synergy with J-STD-001 and IPC/WHMA-A-620.
IPC 2221B-2012
Generic Standard on Printed Board Design
This standard establishes the general requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. These requirements establish design principles and recommendations that shall be used to produce detailed designs intended to mount and attach passive and active components.
IPC J-STD-001H-2020
IPC-J-STD-001H: Requirements for Soldered Electrical and Electronic Assemblies
IPC-J-STD-001H is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001H standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means. IPC-J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements. If you purchased IPC-J-STD-001H you should also purchase and use IPC-A-610H, they work together.
IPC J-STD-002E-2017
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user. The IPC-J-STD-002E standard was developed by the following three organizations: ECIA, IPC and JEDEC.
IPC 9592B-2012
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
This document standardizes the requirements for power conversion devices (PCDs) for the computer and telecommunications industries. This specification sets the requirements for design, qualification testing, conformance testing and manufacturing quality/reliability processes, but does not include the functional requirements of the specific equipment. This revision includes more definitive preconditioning tests for surface mount PCD modules used for category 2 devices (dc to dc converters). Revision A also expands the coverage of moisture sensitivity levels (MSLs) for PCDs and addresses corrosion of PCDs in various commercial, manufacturing and uncontrolled external environments. It also significantly increases the coverage of the HALT (highly accelerated life testing) description and application to PCDs.
IPC CC-830C-2019
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the materials with minimum test redundancy. The IPC-CC-830C standard covers: • The qualification and qualification retention of the conformal coating material (Table 3-1, Column A and B). • The quality conformance of conformal coating material properties (Table 3-1, Column C). For the purpose of this standard, the term conformal coating is used herein when referring to a type of protective coating for use on printed wiring assemblies. The conformal coating is intended to provide protection from moisture and contamination and provide electrical insulation; not as a sole source of mechanical support.
IPC A-600K-2020
Acceptability of Printed Boards
The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision K provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap plating, via fill and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012D and IPC-6013C. Supersedes IPC-A-600J.
IPC 6012E-2020
Qualification and Performance Specification for Rigid Printed Boards
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
IPC 2152-2009
Standard for Determining Current Carrying Capacity in Printed Board Design
The sole industry standard for determining appropriate internal and external conductor sizes on printed boards as a function of the current carrying capacity required and the acceptable conductor temperature rise. This document provides guidance on how thermal conductivity, vias, copper planes, power dissipation and printed board material and thickness all factor into the relationship between current, conductor size and temperature.
