Historical
IPC 4101B-2006
Specification for Base Materials for Rigid and Multilayer Printed Boards
This specification covers the requirements for base materials (laminate and prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand the newer assembly operations employing higher thermal exposures, including those assembly practices that utilize the now commonly-encountered lead free solders.
Association Connecting Electronics Industries [ipc]