IPC 4101B+Amd1-2007

Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendments 1

This specification covers the requirements for base materials (laminate and prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. This document contains more than 50 separate specification sheets and now uses search terms to allow the user to find similar groups of materials from these specification sheets. This standard provides the user with additional information and data on printed circuit board materials that are better able to withstand the newer assembly operations employing higher thermal exposures, including those assembly practices that use the now commonly-encountered lead free solders. Amendment 1 to Revision B inserts the proper information on Conductive Anodic Filament (CAF) growth into Specification Sheets 29, 30, 70, 71, 126 and 129, as well as into appropriate sections of this document's body. Additionally, Amendment 1 provides correct test frequencies, test methods and Laminate Requirements for both Permittivity and Loss Tangent in Specification Sheets 126 and 129.