Historical

IPC 4203B-2018

Cover and Bonding Material for Flexible Printed Circuitry

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non-flexible adhesives designed to be used in the rigid board areas of rigid flex constructions, which are covered in IPC-4101. Materials such as liquid-applied covercoat (see 3.1.8.3) are covered in IPC-SM-840 and are excluded from this document. 38 pages.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Others Also Bought
Specification for Base Materials for Rigid and Multilayer Printed Boards
Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Included in Packages
This standard is not included in any packages.
Document History
Revises:
Revised By:
Amendments & Corrections
We have no amendments or corrections for this standard.