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IPC 4203C-2025
Specification for Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.
Association Connecting Electronics Industries [ipc]