Most recent

IPC 4203C-2025

Specification for Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, and supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry.

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

Others Also Bought
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Included in Packages
This standard is not included in any packages.
Document History
Revises:
Amendments & Corrections
We have no amendments or corrections for this standard.