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IPC 4552B-2021
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
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Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]