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IPC 7093-2011
Design and Assembly Process Implementation for Bottom Termination Components
Describes the design and assembly challenges for implementing bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes industry descriptive nomenclature such as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair and reliability issues associated with BTCs.
Content Provider
Association Connecting Electronics Industries [ipc]
