Historical
IPC 7525B-2011
Stencil Design Guidelines
Provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. These guidelines detail the differences for tin-lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
Content Provider
Association Connecting Electronics Industries [ipc]
