IPC 7525B-2011

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Stencil Design Guidelines

Provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. These guidelines detail the differences for tin-lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

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Association Connecting Electronics Industries [ipc]

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Stencil Design Guidelines

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IPC 7525B-2011

Stencil Design Guidelines

Are the documents at the ANSI Webstore in electronic Adobe Acrobat PDF format only?

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