Historical
IPC 7094-2009
Design and Assembly Process Implementation for Flip Chip and Die Size Components
products that employ the very complex and high density methods needed for flip-chip technology. The major emphasis of the new standard is to provide information on system-level issues, flipchip and die-size assembly and the requirements for board and module-level reliability. In addition to providing guidelines for flip-chip inspection, IPC-7094 addresses the design of the initial element and how the die can be evaluated during its development process with a goal toward simplification of the final assembly. The standard also covers outsourcing manufacturing and the procurement of known good die to optimize the return on investment when developing products that use flip-chip technology.
- ADD TO ALERT |
- PDF |
- DRM |
Association Connecting Electronics Industries [ipc]