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IPC 7094A-2018
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-level ball grid array (WLBGA). It provides useful and practical information to those who mount bare-die or die-size components in a DCA assembly or those who are considering flip chip process implementation.
Content Provider
Association Connecting Electronics Industries [ipc]
