Historical
IPC 7525A-2007
Stencil Design Guidelines
This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
Content Provider
Association Connecting Electronics Industries [ipc]
