Historical
IPC 7711/7721C-2017
Rework, Modification and Repair of Electronic Assemblies
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures
Content Provider
Association Connecting Electronics Industries [ipc]
