Historical

IPC 7711/7721C-2017

Rework, Modification and Repair of Electronic Assemblies

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures

CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

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