Historical

IPC 7711/7721C+AM1-2020

Rework, Modification and Repair of Electronic Assemblies + Amendment 1


This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.


CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]

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Included in Packages
This standard is not included in any packages.
Document History
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Amendments & Corrections