Most recent
IPC/JEDEC J-STD-033C+Amd1-2014
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
Content Provider
Association Connecting Electronics Industries [ipc]
