Historical
IPC/JEDEC J-STD-033C-2012
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
This document provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By following the procedures, safe and damagefree reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags.
CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]