Historical
SAE AMS 3690B-1993 (SAE AMS3690B-1993)
Adhesive Compound, Epoxy, Room Temperature Curing ( Reaffirmed: Dec 2000 )
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 85 degrees C (185 degrees F), but usage is not limited to such applications.
CONTENT PROVIDER
Society of Automotive Engineers [sae]
Society of Automotive Engineers [sae]