Historical
SAE AMS 3690C-2009 (SAE AMS3690C-2009)
Adhesive Compound, Epoxy, Room Temperature Curing
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for non-structural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components nd devices operating at not higher than 185 \mDF (85 \mDC), but usage is not limited to such applications.
Content Provider
Society of Automotive Engineers [sae]
