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Other Fabrication Standards

Semiconductor Fabrication Standards cover the production process of semiconductors. Given the importance of clean rooms, these standards address gas distribution in that context, as well as the use and quality of water. Additionally, IEC 62258 provides information about semiconductor die products. Other topics of importance are included as well, such as EM immunity, examination of semiconductors, and aerospace-specific requirements.

NFPA 318-2022

Standard for the Protection of Semiconductor Fabrication Facilities

This standard presents requirements to safeguard facilities containing cleanrooms from fire and related hazards to protect against injury, loss of life, and property damage. It applies to semiconductor fabrication facilities and comparable fabrication processes, including research and development areas in which hazardous chemicals are used, stored, and handled and containing a cleanroom, or clean zone, or both.

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IEC 60269-4 Ed. 5.1 b:2012

Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

"IEC 60269-4:2009+A1:2012 is to be used in conjunction with IEC 60269-1. This Part 4 supplements or modifies the corresonding clauses or subclauses of Part 1. Fuse-links for the protection of semiconductor devices shall comply with aIl requirements of IEC 60269-1, if not otherwise indicated hereinafter, and shall also comply with the supplementary requirements laid down below. This fifth edition cancels and replaces the fourth edition published in 2006. It constitutes a technical revision. The significant technical changes to the fourth edition are: - the introduction of voltage source inverter fuse-links, including test requirements; - coverage of the tests on operating characteristics for a.c. by the breaking capacity tests; - the updating of examples of standardised fuse-links for the protection of semiconductor devices. This consolidated version consists of the fifth edition (2009) and its amendment 1 (2012). Therefore, no need to order amendment in addition to this publication. "

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ASTM F1709-97(2016)

Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

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IEC 60204-33 Ed. 1.0 b:2009

Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment

"IEC 60204-33:2009 applies to electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors. It is applicable to the electrical equipment or parts of the electrical equipment that operate with nominal supply voltages not exceeding 1 000 V for alternating current (a.c.) and not exceeding 1 500 V for direct current (d.c.), and with nominal supply frequencies not exceeding 200 Hz. For higher voltages or frequencies, special requirements IEC 60204 applies to electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors. "

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IEC 61922 Ed. 1.0 b:2002

High-frequency induction heating installations - Test methods for the determination of power output of the generator

Applicable to industrial radio- or high-frequency induction heating installations used for the purpose of thermal applications (e.g. for surface hardening, welding, soldering, melting, forging, zone refining of semiconductors, etc.). Relates to high-frequency induction heating installations in the frequency range up to 300 MHz for power levels of 500 W and above, comprising high-frequency generators and inductors together with necessary mechanical devices for charge handling (e.g. hardening machines). The main purpose is to provide the test methods for the determination of output power of industrial high-frequency induction heating power sources.

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IPC J-STD-026-1999

Semiconductor Design Standard for Flip Chip Applications

This standard addresses semiconductor chip design. It is intended for applications utilizing standard substrates, materials, assembly, and test methods as well as established semiconductor fabrication and bumping processes.

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