Historical
IPC 7095C-2013
Design and Assembly Process Implementation for BGAs
This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types is addressed, as is the move to lead-free assembly processes. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs. Throughout this document the word ‘‘BGA’’ can mean all types and forms of ball/column/bump/pillar grid array packages.
CONTENT PROVIDER
Association Connecting Electronics Industries [ipc]
Association Connecting Electronics Industries [ipc]