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IPC J-STD-033D-2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
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Association Connecting Electronics Industries [ipc]
